Erosion resistant textured chamber surface

ABSTRACT

A component for a substrate processing chamber has a structure having an overlying metal coating. The metal coating has a plurality of electron beam textured features that are formed by scanning an electron beam across a surface of the metal coating. The electron beam textured features include a plurality of depressions and protuberances on the surface that are capable of accumulating process deposits during processing of a substrate to reduce contamination of the substrate. The component having the metal coating provides improved processing results, and exhibits reduced erosion during cleaning processes performed to remove process deposits from the component.

BACKGROUND

In the processing of substrates such as semiconductor wafers anddisplays, a substrate is placed in a process chamber and exposed to anenergized gas to deposit or etch material on the substrate. During suchprocessing, process residues are generated and can deposit on internalsurfaces in the chamber. For example, in sputter deposition processes,material sputtered from a target for deposition on a substrate alsodeposits on other component surfaces in the chamber, such as ondeposition rings, shadow rings, wall liners, and focus rings. Insubsequent process cycles, the deposited process residues can “flakeoff” of the chamber surfaces to fall upon and contaminate the substrate.To reduce the contamination of the substrates by process residues, thesurfaces of components in the chamber can be textured. Process residuesadhere to the textured surface and inhibit the process residues fromfalling off and contaminating the substrates in the chamber.

In one version, the textured component surface is formed by directing anelectromagnetic energy beam onto a surface of a process chambercomponent surface to form depressions and protrusions to which processdeposits adhere. An example of such a surface is a Lavacoat™ surface, asdescribed for example in U.S. Patent Publication No. 2003-0173526 toPopiolkowski et al, published on Sep. 18, 2003, and filed on Mar. 13,2002; and U.S. Patent Publication No. 2004-0056211 to Popiolkowski etal, published on Mar. 25, 2004, and filed on Jul. 17, 2003—both commonlyassigned to Applied Materials, Inc, and both of which are incorporatedherein by reference in their entireties. The Lavacoat™ surface comprisesdepressions and protrusions to which process residues can adhere toreduce the contamination of substrates during their processing.

While components having textured surfaces provide improved residueadherence over other types of process components, performance issues canarise when the components are cleaned to remove accumulated processresidues. In an exemplary cleaning process, the component comprising thetextured surface is immersed in a cleaning solution, such as an acidicsolution. However, cleaning solutions that are capable of cleaningprocess residues can also erode the textured surface to alter thesurface features, and consequently, reduce the adherence of processresidues thereto. For example, textured component surfaces comprisingaluminum and titanium can be eroded by an acidic solution of HNO₃ andHF—which is used to remove tantalum-containing process residues from thecomponent surfaces. Because the eroded surfaces can exhibit poor residueadhesion, the components may require replacement or refurbishment afteronly a few cleaning cycles, thereby increasing substrate processingcosts and chamber downtime.

Accordingly, it is desirable to have a component comprising a texturedsurface that provides good adherence of process residues, to improveprocessing results and reduce contamination of substrates. It is furtherdesirable to be able to effectively clean accumulated process residuesfrom the component surface without erosion of the residues duringcleaning. It is further desirable to have a method of fabricating acomponent having a textured surface that has improved erosion resistanceduring cleaning processes and provides good results in the processing ofsubstrates.

SUMMARY

In one version, a component for a substrate processing chamber has astructure having an overlying metal coating. The metal coating has aplurality of electron beam textured features that are formed by scanningan electron beam across a surface of the metal coating. The texturedfeatures include a plurality of depressions and protuberances that arecapable of accumulating process deposits during processing of asubstrate to reduce contamination of the substrate. The component havingthe metal coating provides improved processing results, and exhibitsreduced erosion during cleaning processes performed to remove processdeposits from the component.

In another version, a process kit for a substrate processing chamber hasa ring adapted to at least partially surround a substrate in theprocessing chamber. The ring is of a metallic material, and has astainless steel coating. The stainless steel coating has electron beamtextured features thereon, the electron beam textured features having aplurality of depressions and protuberances. The process kit providesimproved erosion resistance in the substrate processing chamber.

In yet another version, a process chamber shield for a substrateprocessing chamber has a shield structure that is adapted to at leastpartially shield a process chamber wall. The shield structure is of ametallic material, and has a stainless steel coating. The stainlesssteel coating has electron beam textured features thereon, the electronbeam textured features having a plurality of depressions andprotuberances. The process chamber shield provides improved erosionresistance in the substrate processing chamber.

In another version, a method of fabricating a component for a substrateprocessing chamber includes providing a component structure and forminga metal coating on the component structure. An electron beam is scannedacross a surface of the metal coating to form a plurality of texturedfeatures including depressions and protuberances on the surface. Themetal coating can be formed by at least partially melting a coatingmaterial and propelling the coating material onto the componentstructure.

DRAWINGS

These features, aspects, and advantages of the present invention willbecome better understood with regard to the following description,appended claims, and accompanying drawings, which illustrate examples ofthe invention. However, it is to be understood that each of the featurescan be used in the invention in general, not merely in the context ofthe particular drawings, and the invention includes any combination ofthese features, where:

FIG. 1 a is a sectional side view of a component having a metal coatingand a textured surface formed by scanning an electromagnetic energy beamacross the layer;

FIG. 1 b is a sectional top view of an embodiment of the component ofFIG. 1 a; and

FIG. 2 is a sectional side view of an embodiment of a substrateprocessing chamber having one or more components comprising electronbeam textured features on a metal coating.

DESCRIPTION

A process chamber component 22 having a textured surface 20 is providedfor the processing of substrates in an energized gas in a processchamber 106, as shown for example in FIGS. 1 a and 1 b. The component 22having the textured surface reduces particle generation in the processchamber 106 by providing a “sticky” surface to which process deposits 24adhere, thus allowing the deposits 24 to accumulate on the texturedsurface 20. Process deposits 24 that adhere to the textured surface 20can include metal-containing deposits, such as deposits comprising atleast one of tantalum, tantalum nitride, titanium, titanium nitride,aluminum, copper, tungsten, and tungsten nitride. The chamber components22 having the textured surface 20 can comprise, for example, a portionof a gas delivery system 112 that provides process gas in the chamber106, a substrate support 114 that supports the substrate 104 a in thechamber 106, a process kit 139, a gas energizer 116 that energizes theprocess gas, chamber enclosure walls 118 and shields 120, or a gasexhaust 122 that exhausts gas from the chamber 106.

Referring to FIG. 2, which illustrates an exemplary version of aphysical vapor deposition chamber 106, components 22 having the texturedsurface 20 can include a chamber enclosure wall 118, a chamber shield120, a target 124, a target rim 125, a component of a process kit 139such as at least one of a cover ring 126 and a deposition ring 128, asupport ring 130, insulator ring 132, a coil 135, coil support 137,shutter disk 104 b, clamp shield 141, and a portion of the substratesupport 114. For example, components having the textured surface caninclude Applied Material's part numbers 0020-50007, 0020-50008,0020-50010, 0020-50012, 0020-50013, 0020-48908, 0021-23852, 0020-48998,0020-52149, 0020-51483, 0020-49977, 0020-52151, 0020-48999, 0020-48042and 0190-14818, from Applied Materials, Santa Clara, Calif. This list ofcomponents is merely exemplary and the other components or componentsfrom other types of chambers can also have the textured surface, thus,the present invention should not be limited to the components listed ordescribed herein.

In one version, one or more process chamber components 22 comprise asurface that is textured by scanning an electromagnetic energy beam 40such as an electron beam 40 across the surface 20, to form electron beamtextured features 25 on the surface. An example of such a texturedsurface 20 is that formed by a Lavacoat™ process, as described forexample in U.S. patent application Ser. No. 10/653,713 to West, et al,filed on Sep. 2, 2003, entitled “Fabricating and Cleaning ChamberComponents Having Textured Surfaces,” and aforementioned U.S. PatentPublication Nos. 2003/0173526 and 2004/0056211, all commonly assigned toApplied Materials, Inc., and all of which are incorporated herein byreference in their entireties. The electron beam textured features 25 ofthe Lavacoat™ process comprise a plurality of depressions 23 andprotuberances 26 to which process deposits 24 generated duringprocessing can adhere, as shown for example in FIG. 1 a.

The Lavacoat™ textured surface 20 can be formed by generating anelectromagnetic energy beam 40, such as an electron beam 40, anddirecting the beam onto the surface 20 of the component 22. While theelectromagnetic energy beam is preferably an electron beam, it can alsocomprise protons, neutrons and X-rays and the like. The beam 40 istypically focused on a region of the surface 20 for a period of time,during which time the beam 40 interacts with the surface 20 to form thetextured features 25 on the surface 20. It is believed that the beam 40forms the features 25 by rapidly heating the region of the surface 20,typically to a melting temperature of the surface material. At least aportion of the surface material may even be evaporated or ablated fromthe surface 20 by the rapid heating. The rapid heating causes some ofthe surface material to be ejected outwards, which forms depressions 23in the regions the material was ejected from, and protuberances 26 inareas where the ejected material re-deposits. After the desired featuresin the region are formed, the beam 40 is scanned to a different regionof the component surface 20 to form features in the new region.

The electromagnetic energy beam 40 can be scanned across the surface 20to form a desired pattern of textured features 25 on the surface 20,such as a honeycomb-like structure of depressions 23 and protuberances26, as shown for example in FIG. 1 a. The features 25 formed by thismethod are typically macroscopically sized. For example, the depressions23 can have a depth d as measured from a base level 28 of the surface 20of from about 20 micrometers to about 1600 micrometers. A surfacediameter w of the depressions 23 may be from about 120 micrometers toabout 2600 micrometers and even from about 200 micrometers to about 2300micrometers. The protuberances 26 can comprise a height h above the basesurface 28 of from about 50 micrometers to about 1600 micrometers, andeven from about 100 micrometers to about 1200 micrometers. The Lavacoat™textured surface 20 can have an overall surface roughness average offrom about 60 micrometers to about 100 micrometers, the roughnessaverage of the surface 20 being defined as the mean of the absolutevalues of the displacements from the mean line of the features along thesurface 20. The textured surface 20 can also be further roughened afterscanning with the electromagnetic energy beam 40 to provide differentlevels of texture on the surface 20, as described for example in thepatent applications to Popiolkowski et al. and West et al. that areincorporated by reference above. For example, the surface 20 can be gritblasted by propelling grit particles towards the surface 20 withpressurized gas, or can be chemically roughened, to form a relativelyfine texture overlying the macroscopically sized features 25 on thesurface 20. The roughened surface 20 improves the adhesion of processdeposits 24 to reduce contamination of the processed substrates 104 a.

In one version, the textured surface 20 can be formed on a metal coating30 on the component 22, as shown for example in FIG. 1 a. The metalcoating 30 desirably comprises a material that is resistant to erosionby the energized gases provided to process a substrate 104 a or cleanthe process chamber 106, and is also desirably resistant to erosion fromcleaning solutions that may be used to clean the component 20, such asacidic or basic cleaning solutions. The metal coating 30 can be formedon a surface 33 of an underlying structure 32 of the component 30 toprotect the underlying structure 32. For example, the underlyingstructure 32 may comprise a first material having desired properties,such as desired thermal and mechanical properties, and the metal coating30 may comprise a second material having higher erosion resistance thanthe first material. The metal coating 30 may also comprise a materialthat can be treated to provide a desired texture of the metal coatingsurface, such as for example a desired roughness or textured pattern onthe surface 20, that could not otherwise be desirably provided by thematerial of the underlying structure 32. For example, the material ofthe metal coating may be selected to allow for a finer or roughertexturing of the metal coating surface 20. A suitable material for themetal coating 30 can be selected with respect to the substrateprocessing requirements to provide the desired properties, and cancomprise for example at least one of stainless steel, copper, nickel,tantalum and titanium.

A material having suitable properties for the underlying structure 32may be a metallic material, such as for example at least one oftitanium, stainless steel; copper, tantalum and aluminum; and can alsocomprise a ceramic material, such as at least one of aluminum oxide,aluminum nitride, and quartz. The underlying structure is selectedaccording to desired properties such as desired thermal and mechanicalproperties. For example, an underlying structure 32 comprising aluminummay be desirable because aluminum is typically a relatively cheapmaterial having good thermal conductivity. An underlying structure 32comprising stainless steel may provide good erosion resistance andthermal conductivity. An underlying structure 32 comprising titanium mayprovide a desired relatively low thermal coefficient of expansion. Also,an underlying structure 32 comprising copper may provide good thermalconductivity as well as a relatively low thermal coefficient ofexpansion. Underlying structures 32 comprising a ceramic material, suchas aluminum oxide, may provide a desired level of thermal insulationand/or thermal conductivity, and a desired relatively low thermalcoefficient of expansion. In one suitable embodiment, a metal coating 30comprising stainless steel is formed over an underlying structure 32comprising aluminum or titanium, such as a process kit or shieldstructure, to provide a component 22 having a textured surface 20 withimproved erosion resistance while maintaining the desired overallmechanical and thermal properties of the component 22. In anothersuitable embodiment, a metal coating 30 comprising stainless steel isformed over an underlying structure 32 comprising aluminum oxide.

In one version, the metal coating 30 can be providing by spraying acoating of material over the surface 33 of the underlying componentstructure 32. Suitable spraying methods can include thermal sprayingmethods, such as for example at least one of HVOF (high velocity oxygenfuel), flame spraying, plasma spraying, twin wire or single wire arcspraying, welding methods such as TIG, and other thermal sprayingmethods, which are capable of forming well-bonded coatings. In a typicalthermal spraying method, the coating material in powder or wire form isheated to a molten or near-molten state, for example by a torch. Apressurized gas is used to propel the coating material onto the surface33 of the underlying structure 32. For example, in the HVOF method, anHVOF spray gun ignites an oxygen-fuel mixture to heat and at leastpartially melt the coating material as it is propelled towards thestructure surface 33. A HVOF spray gun that may be suitable for formingthe metal coating 30 is the HVOF spray gun available from Sulzer MetcoHolding AG in Winterthur, Switzerland. Alternatively, the metal coating30 can be formed by other methods, such as by electroplating metalcoating material on the underlying structure 32, or by a physical orchemical vapor deposition method.

The metal coating 30 desirably comprises a thickness that issufficiently high to provide good erosion resistance and allow for theformation of the textured features 25 on the surface 20 of the coating30. The metal coating 30 is desirably also sufficiently thin to providegood adhesion of the coating 30 to the underlying structure 32 toinhibit spalling or flaking of the coating 30 from the structure. Asuitable thickness may be a thickness of the metal coating 30 may fromabout 120 micrometers to about 2600 micrometers, such as from about 500micrometers to about 1300 micrometers. The metal coating 30 can beformed over substantially the entire surface 33 of the underlyingstructure 32, or on selected portions of the structure surface 33 thatare, for example, especially susceptible to erosion, or that tend toaccumulate large quantities of process deposits 24. Once the metalcoating 30 has been formed, the coating 30 can be textured, for exampleby scanning an electron beam 40 across the surface 20 of the coating 30,to form the textured features 25 that are capable of collecting processdeposits during the processing of substrates 104 a. The texturedfeatures 25 are desirably formed substantially entirely in the metalcoating 30, and substantially without exposing the underlying structure32, as shown for example in FIG. 1 a.

The component 22 comprising the metal coating 30 having the texturedsurface 20 can be cleaned after processing a predetermined number ofsubstrates 104 a to remove process deposits 24 that have accumulated onthe textured surface 20, such as tantalum-containing deposits. Forexample, the textured surface 20 of the component 22 can be immersed ina cleaning solution, such as an acidic solution of 20% by weight HF and80% by weight HNO₃, to clean the process deposits 24. Any exposedregions of the surface 33 of the underlying structure 32 that are notcovered by the metal coating 30 can be masked with a protectivematerial, such as a polyester-based material, to protect the regionsfrom erosion by the cleaning solution. An example of a protectivematerial may be polyester tape (plater's tape) commercially availablefrom 3M™, United States. Other cleaning solutions and steps may also beprovided, such as rinsing with de-ionized water, ultrasonicating, bakingor immersing in other chemical cleaning solutions.

The component 22 having the metal coating 30 with the textured surface20 provides improved results over components 22 without the metalcoating 30. For example, a component 22 having a metal coating 30 withan electron beam textured surface 20 that comprises stainless steel, andthat is formed over an underlying structure 32 comprising aluminum ortitanium, can be cleaned in a cleaning solution comprising HF and HNO₃and recycled for re-use in the process chamber 106 at least about 10times, while continuing to provide good processing results in thechamber 106. In contrast, a component 22 without a metal coating 30,such as a component 22 consisting of aluminum and having an electronbeam textured surface 20, is typically capable of being cleaned andre-cycled for re-use in the process chamber 106 no more than about 3times, before the erosion of the component 22 becomes too severe toprovide good processing results.

An example of a suitable process chamber 106 having a component 22 witha metal coating 30 and electron beam textured features 25 and is shownin FIG. 2. The chamber 106 can be a part of a multi-chamber platform(not shown) having a cluster of interconnected chambers connected by arobot arm mechanism that transfers substrates 104 a between the chambers106. In the version shown, the process chamber 106 comprises a sputterdeposition chamber, also called a physical vapor deposition or PVDchamber, which is capable of sputter depositing material on a substrate104 a, such as one or more of tantalum, tantalum nitride, titanium,titanium nitride, copper, tungsten, tungsten nitride and aluminum. Thechamber 106 comprises enclosure walls 118 that enclose a process zone109, and that include sidewalls 164, a bottom wall 166, and a ceiling168. A support ring 130 can be arranged between the sidewalls 164 andceiling 168 to support the ceiling 168. Other chamber walls can includeone or more shields 120 that shield the enclosure walls 118 from thesputtering environment.

The chamber 106 comprises a substrate support 114 to support substrates104 a in the sputter deposition chamber 106. The substrate support 114may be electrically floating or may comprise an electrode 170 that isbiased by a power supply 172, such as an RF power supply. The substratesupport 114 can also support other wafers 104 such as a moveable shutterdisk 104 b that can protect the upper surface 134 of the support 114when the substrate 104 a is not present. In operation, the substrate 104a is introduced into the chamber 106 through a substrate loading inlet(not shown) in a sidewall 164 of the chamber 106 and placed on thesupport 114. The support 114 can be lifted or lowered by support liftbellows and a lift finger assembly (not shown) can be used to lift andlower the substrate onto the support 114 during transport of thesubstrate 104 a into and out of the chamber 106.

The support 114 may also comprise a process kit 139 one or more rings,such as a cover ring 126 and a deposition ring 128, which cover at leasta portion of the upper surface 134 of the support 114 to inhibit erosionof the support 114. In one version, the deposition ring 128 at leastpartially surrounds the substrate 104 a to protect portions of thesupport 114 not covered by the substrate 104 a. The cover ring 126encircles and covers at least a portion of the deposition ring 128, andreduces the deposition of particles onto both the deposition ring 128and the underlying support 114.

A process gas, such as a sputtering gas, is introduced into the chamber106 through a gas delivery system 112 that includes a process gas supplycomprising one or more gas sources 174 that each feed a conduit 176having a gas flow control valve 178, such as a mass flow controller, topass a set flow rate of the gas therethrough. The conduits 176 can feedthe gases to a mixing manifold (not shown) in which the gases are mixedto from a desired process gas composition. The mixing manifold feeds agas distributor 180 having one or more gas outlets 182 in the chamber106. The process gas may comprise a non-reactive gas, such as argon orxenon, which is capable of energetically impinging upon and sputteringmaterial from a target. The process gas may also comprise a reactivegas, such as one or more of an oxygen-containing gas and anitrogen-containing gas, that are capable of reacting with the sputteredmaterial to form a layer on the substrate 104 a. Spent process gas andbyproducts are exhausted from the chamber 106 through an exhaust 122which includes one or more exhaust ports 184 that receive spent processgas and pass the spent gas to an exhaust conduit 186 in which there is athrottle valve 188 to control the pressure of the gas in the chamber106. The exhaust conduit 186 feeds one or more exhaust pumps 190.Typically, the pressure of the sputtering gas in the chamber 106 is setto sub-atmospheric levels.

The sputtering chamber 106 further comprises a sputtering target 124facing a surface 105 of the substrate 104 a, and comprising material tobe sputtered onto the substrate 104 a, such as for example at least oneof tantalum and tantalum nitride. The target 124 is electricallyisolated from the chamber 106 by an annular insulator ring 132, and isconnected to a power supply 192. The sputtering chamber 106 also has ashield 120 to protect a wall 118 of the chamber 106 from sputteredmaterial. The shield 120 can comprise a wall-like cylindrical shapehaving upper and lower shield sections 120 a, 120 b that shield theupper and lower regions of the chamber 106. In the version shown in FIG.2, the shield 120 has an upper section 120 a mounted to the support ring130 and a lower section 120 b that is fitted to the cover ring 126. Aclamp shield 141 comprising a clamping ring can also be provided toclamp the upper and lower shield sections 120 a,b together. Alternativeshield configurations, such as inner and outer shields, can also beprovided. In one version, one or more of the power supply 192, target124, and shield 120, operate as a gas energizer 116 that is capable ofenergizing the sputtering gas to sputter material from the target 124.The power supply 192 applies a bias voltage to the target 124 withrespect to the shield 120. The electric field generated in the chamber106 from the applied voltage energizes the sputtering gas to form aplasma that energetically impinges upon and bombards the target 124 tosputter material off the target 124 and onto the substrate 104 a. Thesupport 114 having the electrode 170 and support electrode power supply172 may also operate as part of the gas energizer 116 by energizing andaccelerating ionized material sputtered from the target 124 towards thesubstrate 104 a. Furthermore, a gas energizing coil 135 can be providedthat is powered by a power supply 192 and that is positioned within thechamber 106 to provide enhanced energized gas characteristics, such asimproved energized gas density. The gas energizing coil 135 can besupported by a coil support 137 that is attached to a shield 120 orother wall in the chamber 106.

The chamber 106 can be controlled by a controller 194 that comprisesprogram code having instruction sets to operate components of thechamber 106 to process substrates 104 a in the chamber 106. For example,the controller 194 can comprise a substrate positioning instruction setto operate one or more of the substrate support 114 and substratetransport to position a substrate 104 a in the chamber 106; a gas flowcontrol instruction set to operate the flow control valves 178 to set aflow of sputtering gas to the chamber 106; a gas pressure controlinstruction set to operate the exhaust throttle valve 188 to maintain apressure in the chamber 106; a gas energizer control instruction set tooperate the gas energizer 116 to set a gas energizing power level; atemperature control instruction set to control temperatures in thechamber 106; and a process monitoring instruction set to monitor theprocess in the chamber 106.

Although exemplary embodiments of the present invention are shown anddescribed, those of ordinary skill in the art may devise otherembodiments which incorporate the present invention, and which are alsowithin the scope of the present invention. For example, the features 25can be formed on the surface 20 by means other than those specificallydescribed. Also, the metal coating 30 may comprise materials other thanthose described, and may be formed by alternative suitable methods.Furthermore, relative or positional terms shown with respect to theexemplary embodiments are interchangeable. Therefore, the appendedclaims should not be limited to the descriptions of the preferredversions, materials, or spatial arrangements described herein toillustrate the invention.

1. A component for a substrate processing chamber, the componentcomprising: (a) a component structure; (b) a metal coating on thecomponent structure; and (c) electron beam textured features on themetal coating, the electron beam textured features comprising aplurality of depressions and protuberances, whereby the componentprovides improved erosion resistance in the substrate processingchamber.
 2. A component according to claim 1 wherein the metal coatingcomprises at least one of stainless steel, copper, nickel, tantalum andtitanium.
 3. A component according to claim 2 wherein the metal coatingcomprises a sprayed coating that is formed by at least partially meltingcoating material and propelling the coating material onto the componentstructure.
 4. A component according to claim 1 wherein the metal coatinghas a thickness of from about 120 micrometers to about 2600 micrometers.5. A component according to claim 1 wherein the electron beam texturedfeatures comprise depressions having (i) a depth of from about 20micrometers to about 1600 micrometers, and (ii) a surface diameter offrom about 120 micrometers to about 2600 micrometers, and protuberancescomprising a height of from about 50 micrometers to about 1600micrometers.
 6. A component according to claim 1 wherein the componentcomprises at least one of a chamber enclosure wall, a chamber shield, atarget, a target rim, a cover ring, a deposition ring, a support ring,an insulator ring, a coil, a coil support, a shutter disk, a clampshield, and a portion of a substrate support.
 7. A substrate processingchamber comprising the component of claim 1, the chamber comprising asubstrate support, gas delivery system, gas energizer and exhaust.
 8. Aprocess kit for a substrate processing chamber, the process kitcomprising: (a) a ring adapted to at least partially surround asubstrate in the processing chamber, the ring comprising a metallicmaterial; (b) a stainless steel coating on the ring; and (c) electronbeam textured features on the stainless steel coating, the electron beamtextured features comprising a plurality of depressions andprotuberances, whereby the process kit provides improved erosionresistance in the substrate processing chamber.
 9. A component accordingto claim 8 wherein the electron beam textured features comprisedepressions having (i) a depth of from about 20 micrometers to about1600 micrometers, and (ii) a surface diameter of from about 120micrometers to about 2600 micrometers, and protuberances comprising aheight of from about 50 micrometers to about 1600 micrometers.
 10. Acomponent according to claim 8 wherein the ring comprises a metallicmaterial comprising at least one of titanium, stainless steel, copper,tantalum and aluminum.
 11. A process chamber shield for a substrateprocessing chamber, the shield comprising: (a) a shield structureadapted to at least partially shield a process chamber wall, the shieldstructure comprising a metallic material; (b) a stainless steel coatingon the shield structure; and (c) electron beam textured features on thestainless steel coating, the electron beam textured features comprisinga plurality of depressions and protuberances, whereby the processchamber shield provides improved erosion resistance in the substrateprocessing chamber.
 12. A component according to claim 11 wherein theelectron beam textured features comprise depressions having (i) a depthof from about 20 micrometers to about 1600 micrometers, and (ii) asurface diameter of from about 120 micrometers to about 2600micrometers, and protuberances comprising a height of from about 50micrometers to about 1600 micrometers.
 13. A component according toclaim 11 wherein the shield structure comprises a metallic materialcomprising at least one of titanium, stainless steel, copper, tantalumand aluminum.
 14. A method of fabricating a component for a substrateprocessing chamber, the method comprising: (a) providing a componentstructure; (b) forming a metal coating on the component structure, themetal coating having a surface; and (c) scanning an electron beam acrossthe surface to form a plurality of electron beam textured featurescomprising depressions and protuberances in the surface.
 15. A methodaccording to claim 14 wherein (b) comprises forming a metal coatingcomprising at least one of stainless steel, copper, nickel, tantalum andtitanium.
 16. A method according to claim 14 wherein (b) comprisesspraying a metal coating on the component structure by at leastpartially melting coating material and propelling the coating materialonto the structure.
 17. A method according to claim 14 wherein (b)comprises forming a metal coating having a thickness of from about 120micrometers to about 2600 micrometers.
 18. A method according to claim14 wherein (c) comprises scanning an electron beam across the surface toform a plurality of electron beam textured features comprisingdepressions having (i) a depth of from about 20 micrometers to about1600 micrometers, and (ii) a surface diameter of from about 120micrometers to about 2600 micrometers, and protuberances having a heightof from about 50 micrometers to about 1600 micrometers.